发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURE
摘要 <p>PURPOSE:To facilitate efficient manufacture of both a horizontal mounting type package and a vertical mounting type package by a method wherein a plurality of lead terminals are drawn out only from one of the side surfaces of the package main part and the tips of the leads are formed into specific forms and, further, a support means is made to protrude from the package main part. CONSTITUTION:A package main part 11 has main surfaces 12 and side surfaces 13. A plurality of lead terminals 15 and 25 are drawn out only from one of the side surfaces 13. After the lead terminals 15 and 25 are drawn out to a direction in parallel with the main surface 12, the lead terminals are bent so as to protrude from the surface the same as the main surface 12 with a required length and the tips of the lead terminals 25 are bent again so as to be in parallel with the main surface 12. Further, a support means is made to protrude from the package main part with a protruding dimension the same as the protruding dimensions of the lead terminals 15 and 25. The support means may be a protrusion 19 which is made to protrude from the main surface or a plurality of support leads 16 which are drawn out from the side surface 13 and bent to a direction opposite to the bending direction of a plurality of the lead terminals 15.</p>
申请公布号 JPH0722568(A) 申请公布日期 1995.01.24
申请号 JP19930163048 申请日期 1993.07.01
申请人 NEC CORP 发明人 ISHIKAWA TORU
分类号 H01L23/50;H01L23/31;H01L23/495;H01L25/10;H05K1/18;H05K3/30;H05K3/34;(IPC1-7):H01L23/50 主分类号 H01L23/50
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