发明名称 DIE BONDING MATERIAL
摘要 PURPOSE:To realize law stress characteristic, good adhesiveness and low water absorption characteristic by making the epoxy resin contain a specified percentage of product wherein equivalent ratio between the epoxy resin and bisphenol group, shown with an equation, is specific and which, under excessive amount of epoxy resin, shows reaction, with curing agent and inorganic filler being mandatory components. CONSTITUTION:Relating to the entire epoxy resin, an equivalent ratio [epoxy equivalency of (a)/hydroxyl group equivalence of (b)] between epoxy resin (a) and bisphenols (b) shown by an equation (here R1, R2: aliphatic group whose number of bivalent carbons is 1-5 or a remainder group obtained by subtracting two hydrogens from aromatic group whose number of carbon is 6 or mare is indicated, regardless of identical or different from each other) is 1-5, and a mixture ratio of a product obtained through the reaction under excessive amount of epoxy resin (a) is 30weight%, or more in the entire epoxy resin, with 50 weight % or more being preferred. A resin composite is produced by added with reaction product, or epoxy resin mixture containing it and curing agent, additives such as inorganic filler, etc.
申请公布号 JPH0722441(A) 申请公布日期 1995.01.24
申请号 JP19930160646 申请日期 1993.06.30
申请人 SUMITOMO BAKELITE CO LTD 发明人 SAKAMOTO YUJI;MIZUNO MASUO
分类号 C08G59/30;C08G59/62;H01L21/52;(IPC1-7):H01L21/52 主分类号 C08G59/30
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