| 摘要 |
Element production process in a method for producing an embedded type optoelectronic integrated circuit comprising an optical element part and a signal processing part, includes steps of producing a mask film on a surface of the substrate and removing a predetermined region of the film to produce a selective growth mask, producing a concave portion at a predetermined region on the surface of the substrate by etching using the selective growth mask, producing a crystal layer which is to be an optical element part in the concave part by crystal growth using the selective growth mask, flattening the surface of the crystal layer by grinding swelling crystal at the edges of the concave portion, and removing the selective growth mask and conducting mirror polishing by mechanochemical etching. Therefore, even when an optical device is embedded in the substrate using crystal growth method, a step due to swelling crystal does not arise on the substrate and .parts of wafer damaged by grinding is removed. Thus, the following process is eased.
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