| 摘要 |
PURPOSE:To cut a large-diameter material to be cut by using a small-diameter blade with a high accuracy without distortion. CONSTITUTION:In a slicing machine 1, a ring cutting blade 2 provided with a cutting edge on the inner periphery thereof is rotated, a material to be cut W is inserted into the inner hole of the cutting blade, the material to be cut is moved in a cutting direction to be sliced in a wafer form halfway or to the vicinity of the other end of the material, the material is returned to an original position, sucking cups 26a, 26b are moved to a suction position to suck the end face of the wafer, the material to be cut W with the sucking cups is moved in a reverse direction, the remaining part is sliced, and the cut wafer is discharged by a sucking member 21. In this slicing machine 1, the sucking member 21 is provided with the two or more sucking cups 26a, 26b to the wafer. After the suction position of the sucking cups 26a, 26b opposed to the wafer of a predetermined thickness to be cut is previously set and stored, the sucking cups are moved to the retraction position. Furthermore, when the material to be cut W sliced halfway or to almost the other end thereof is returned to the original position, the sucking cups 26a, 26b are moved to the stored set suction position to suck and hold the wafer. |
