| 摘要 |
PURPOSE:To enable quick failure analysis and reduction of loss when a failure is generated. CONSTITUTION:In a semiconductor device where a semiconductor pellet on which main surface an element is formed and an inner lead electrically connected to the semiconductor pellet 1 are sealed with resin, a fuse 4 is provided in the power supply line for supplying the electrical power to the semiconductor pellet 1 and the fuse portion is sealed with a transparent member 8. Or, the semiconductor pellet 1 and the inner lead are electrically connected with a wire and at least a part of the wire is sealed with the transparent member. |
