| 摘要 |
PURPOSE: To attain boring a single- or multi-layer board at a high speed and high density for avoiding overheating a substrate by providing a substrate which has specified conductive vias, conductive leads mounted on the substrate, and a specified resin sealant. CONSTITUTION: Substrates 102, 103 have a first surface 102A, conductive layer having a dielectric layer and conductive vias 105, 105a-105d provided in the substrate. The conductive vias 105, 105a-105d have conductive leads 101, 101a mounted on the first surface 102A of the substrate 102 having conductive vias 105, 105a-105d extending to one of leads from selected conductive part of the conductive layer. A resin sealant seals the substrate 102, 103 and inside 110, 111 of the leads 101, 101a while leaving the remains of leads 101, 101a exposed outside the resin, thus attaining boring at a high speed and high density for avoiding overheating the substrate 102, 103. |
