| 摘要 |
PURPOSE:To improve the cooling efficiency of a semiconductor package by increasing the surface area of a heat sink by providing many uneven portions of a predetermined size on the surface of the heat sink exposed to the outside of the semiconductor package. CONSTITUTION:A semiconductor package includes a chip 2, a heat sink 1 provided on the chip 2 and exposed to one surface of a resin mold 5, an inner lead 4 provided on a an insulating member 5, and a bonding wire 6 for connecting the chip 2 and the inner lead 4 in the resin mold 5. A portion of the heat sink 1 exposed to the surface of the resin mold 5 is rolled with a roller subject to groove processing and subject to embossing to corrugate the surface of the heat sink 1. Hereby, a heat transfer area of the heat sink 3 to air is increased, and hence the cooling efficiency of the chip 2 is increased. Thus, high power high integration semiconductor integrated circuits are dealt with. |
