| 摘要 |
<p>PURPOSE:To provide a method for resin coating which can thinly and uniformly coat the surface of a semiconductor laser chip with resin and a photodiode chip which can constitute a semiconductor laser device. CONSTITUTION:A semiconductor laser device 3 (stem 8) is mounted to a rotary stand 1 while a laser beam irradiation window 7A at the top of a cap 7 is directed upward. After resin 6 is dripped on chips 5, 4A, and 4B in the cap 7 through the window 7A, the rotary stand 1 is rotated around the shaft in nearly vertical direction, thus enabling a remaining part 6A out of the dripped resin 6 to flow along the inner wall of the cap 7.</p> |
