| 摘要 |
<p>PURPOSE:To provide a mounting method for semiconductor elements which can cope with various chip sizes and by which workability is excellent without causing discharge variance of die bonding paste, cobwebbing, etc., and generating voids, by peeling off a semiconductor element with adhesives from a dicing tape and thermocompression bonding it on an adherend. CONSTITUTION:After a face with a film adhesives 1 is overlaid bonded on a wafer 4 placed on a heat plate 5, a roll 6 is thermocompression on a carrier film 2 to transfer the adhesives 1 from the film 2 onto the wafer 4, thus obtaining the wafer 4 with the adhesives. The obtained wafer 4 is bonded onto a dicing tape 7 while the adhesives 1 side thereof is facing the tape 7. Then it is cut into chips by a dicing saw and they are expanded thereafter. Individual chip 8 with the adhesive which is cut and separated on the tape 7 is sucked by a vacuum suction means 9 to be peeled off from the tape 7. The semiconductor chip 8 is firmly and thermocompression bonded onto a silver plating pattern 13 of a lead frame 12 which is preheated by a preheater 11.</p> |
