发明名称 |
Alkali-developable positive-working photosensitive resin composition |
摘要 |
A novel alkali-developable photosensitive resin composition, which is suitable for use as a photoresist composition for fine patterning in the manufacture of various electronic devices, is proposed. The photosensitive resin composition comprises, as the essential ingredients, (a) an alkali-soluble novolac resin as the film-forming ingredient and (b) a very specific compound which is a 1,2-quinone diazide sulfonic acid ester of a condensation product having a weight-average molecular weight of 400 to 2000 obtained by the condensation reaction between phenol and a hydroxybenzaldehyde in the presence of an acidic catalyst as the photosensitizing agent. By virtue of the formulation with this specific photosensitizer, the resist layer formed from the inventive composition has a greatly increased focusing latitude in addition to the excellent sensitivity, resolution and heat resistance.
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申请公布号 |
US5384228(A) |
申请公布日期 |
1995.01.24 |
申请号 |
US19930134287 |
申请日期 |
1993.10.08 |
申请人 |
TOKYO OHKA KOGYO CO., LTD. |
发明人 |
DOI, KOUSUKE;NIIKURA, SATOSHI;TOKUTAKE, NOBUO;KOHARA, HIDEKATSU;NAKAYAMA, TOSHIMASA |
分类号 |
C07C309/76;G03F7/022;(IPC1-7):G03F7/023;G03F7/30 |
主分类号 |
C07C309/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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