Method of polishing a surface of copper or an alloy comprising mainly copper.

摘要

Method of polishing a surface (5a) of copper or an alloy comprising mainly copper, in which a polishing means is moved across the surface while exerting a polishing pressure of approximately 500 g/cm<2> for obtaining a plane and smooth polished surface without any defects. A composition of a polishing component comprising a colloidal suspension of SiO2 particles having an average particle size of between 20 and 50 nm in an alkali solution, demineralised water and a chemical activator is used as a polishing means. <IMAGE>