发明名称 |
HEATING MEANS FOR THERMOPLASTIC BONDING. |
摘要 |
<p>A heating element for providing localized heating during the thermoplastic bonding of thermoset composite structures is disclosed. Various construction details are developed which disclose an apparatus and method for uniformly heating a bond line. In one embodiment, a heating element (22) includes a resistance heating material (24) sandwiched between two layers of electrical insulation (25) and encased within a layer of thermoplastic material (26). Low resistance electrical leads (28), which extend across the width of the resistance heating material, and a power supply (30) provide electrical energy to raise the temperature of the resistance heating material.</p> |
申请公布号 |
EP0633836(A1) |
申请公布日期 |
1995.01.18 |
申请号 |
EP19930907535 |
申请日期 |
1993.03.17 |
申请人 |
UNITED TECHNOLOGIES CORPORATION |
发明人 |
JACARUSO, GARY, J.;DAVIS, GEOFFREY, C.;MCINTIRE, ALLEN, J. |
分类号 |
B29C65/34;B29K105/06;C09J5/06;(IPC1-7):B29C65/34;C09J5/10 |
主分类号 |
B29C65/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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