发明名称 HEATING MEANS FOR THERMOPLASTIC BONDING.
摘要 <p>A heating element for providing localized heating during the thermoplastic bonding of thermoset composite structures is disclosed. Various construction details are developed which disclose an apparatus and method for uniformly heating a bond line. In one embodiment, a heating element (22) includes a resistance heating material (24) sandwiched between two layers of electrical insulation (25) and encased within a layer of thermoplastic material (26). Low resistance electrical leads (28), which extend across the width of the resistance heating material, and a power supply (30) provide electrical energy to raise the temperature of the resistance heating material.</p>
申请公布号 EP0633836(A1) 申请公布日期 1995.01.18
申请号 EP19930907535 申请日期 1993.03.17
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 JACARUSO, GARY, J.;DAVIS, GEOFFREY, C.;MCINTIRE, ALLEN, J.
分类号 B29C65/34;B29K105/06;C09J5/06;(IPC1-7):B29C65/34;C09J5/10 主分类号 B29C65/34
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