| 摘要 |
PURPOSE:To surely remove an electrostatic shield of a cap, relating to a vessel for a semiconductor device with a resin cap sealing. CONSTITUTION:A stem 1 consisting of the first insulation material provided with a sealing part 1b that surrounds a semiconductor chip 5, and a cap 8, on whose surface a metallized layer 9 is provided, by which a cap mouth edge 8a is bonded to a seal-up part 1b for sealing up with an insulation bond 10, are contained in a vessel for a semiconductor device. The sealing part 1b is provided with the second step 1c, formed so that it engages with the first step 8b provided at the cap mouth edge 8a and at the same time the metallized layer 9 on the surface of the cap 8 contacts to the stem 1, and the sides facing the first and second steps 8b and 1c are configured to serve as bonding surfaces to the cap 8 and the stem 1. |
