| 摘要 |
PURPOSE: To provide a microwave transmission line circuit in addition to an integrated circuit for range of microwave, formed on an active surface of a chip without increasing the surface area of a substrate required for chip forming. CONSTITUTION: A flip-chip semiconductor device, which is provided with at least one integrated circuit and a plurality of metallic input/output pads on the active surface 1a of the semiconductor substrate 1, has a coplanar transmission line circuit with a conductor strip and a ground metallization M11 on the active surface and a microstrip transmission line circuit 113 with a conductor strip disposed on the back surface 1b opposed to the active surface and the ground metallization M11 on the active surface. In addition, a base plate 2 has ground metallization M13 so patterned as to be in electrical contact with the ground metallization on the active surface of the semiconductor device when the semiconductor device is fixed to the base plate 2. |
