发明名称 MANUFACTURE OF ELECTRIC CIRCUIT COLLECTION BODY AND SEMICONDUCTOR PACKAGE DEVICE
摘要 PURPOSE: To enhance resistance to separation and package crazing by using heat spray deposition as the adhesion between a heat dissipating member and a substance to be adhered to this heat dissipating member to cover the heat dissipating member. CONSTITUTION: A heat dissipating member 15 is provided with a relatively thin film 23 applied by heat spray coating method, and a coating of nickel - aluminum applied by flame plasma deposition method. The film 23 considerably enhances the adhesion between a molded compound 19 and the heat dissipating member 15. Thus, the separation therebetween hardly occurs. In this method, the adhesion can be enhanced ten or more times, in response to inherent adhesion of the surface of the heat dissipating member to which the film 23 is applied.
申请公布号 JPH0714858(A) 申请公布日期 1995.01.17
申请号 JP19930203191 申请日期 1993.08.17
申请人 TEXAS INSTR INC <TI> 发明人 KIYASARIN JII HEINEN;BURENDA SHII GOGIYUU;HENRII EFU BUREITO
分类号 H01L21/52;H01L21/48;H01L23/04;H01L23/10;H01L23/373;H01L23/433 主分类号 H01L21/52
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