发明名称 METHOD OF MANUFACTURING MULTILAYERED PRINTED-WIRING-BOARD
摘要 METHOD OF MANUFACTURING MULTILAYERED PRINTED-WIRING-BOARD A method of manufacturing a multilayered printed-wiring-board comprises attaching conductive members on conductive layers, superimposing a plurality of printed-wiring boards, and electrically connecting the conductive layers with one another by the conductive members.
申请公布号 CA2006776(C) 申请公布日期 1995.01.17
申请号 CA19892006776 申请日期 1989.12.28
申请人 JAPAN RADIO CO., LTD. 发明人 YAMASHITA, KAZUO;TAKAHASHI, EIKI;TESHIGAWARA, OSAMU;KINOSHITA, MASAKI;EIMURA, TAKESHI;OHIWA, TAKAO
分类号 H05K1/18;H05K3/28;H05K3/34;H05K3/40;H05K3/46;(IPC1-7):H05K3/00 主分类号 H05K1/18
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