VERFAHREN ZUM BEFESTIGEN VON BAUTEILEN AUF EINER LEITERPLATTE.

摘要

To mount parts by the SMT method, a process is proposed in which the adhesive used is activated by irradiation with light of a wavelength in the range from 200 to 600 nm before assembling the printed circuit board to such an extent that the desired initial stickiness is retained and no skin formation takes place at the adhesive surface. This makes it possible to allow the adhesive compound to cure in a shorter time and at lower temperatures than hitherto without impairing the wetting power of the adhesive during the assembly of the printed circuit board. ……