发明名称 |
SUBSTRATE COMPRISING MULTILAYERED GROUP III-NITRIDE SEMICONDUCTOR BUFFER |
摘要 |
A substrate (200) for group III-nitride devices comprises an initial substrate (102) and a buffer structure (204) of a stack of layer pairs (206, 207, 208, 210) located on the substrate. The material of the substrate is different from the materials of the layer pairs. Each layer pair includes a buffer layer of low-temperature-deposited nitride semiconductor material (212, 216, 220) preferably GaN or AlGan and a single-crystal layer of single-crystal GaN (214, 218, 222) grown directly on the buffer layer. At least one of the layer pairs (210) is structured to exhibit in-plane strain that is no more tensile that the in-plane strain in the single-crystal layer of another of the layer pairs on which the at least one of the layers is located.
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申请公布号 |
WO0025353(A1) |
申请公布日期 |
2000.05.04 |
申请号 |
WO1999US25334 |
申请日期 |
1999.10.28 |
申请人 |
HEWLETT-PACKARD COMPANY;IWAYA, MOTOAKI;TAKEUCHI, TETSUYA;AMANO, HIROSHI;AKASAKI, ISAMU |
发明人 |
IWAYA, MOTOAKI;TAKEUCHI, TETSUYA;AMANO, HIROSHI;AKASAKI, ISAMU |
分类号 |
H01L21/20;H01L21/205;H01L33/12;H01L33/32;H01S5/323;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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