RESIN COMPOSITION FOR ELECTRONIC PARTS.

摘要

The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO2 as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.