| 摘要 |
PROBLEM TO BE SOLVED: To obtain a more high inductance without lowering the selfresonance frequency and the Q-value by the flip chip bonding using bumps for connecting substrates on which spiral inductors are formed. SOLUTION: With respect to a sub-substrate 100 and a main substrate 104, a first connection point 102 and a third connection point 106 are connected through a first bump 108, and a second connection point 103 and a fourth connection point 107 are connected through a second bump 1O9. Therefore, the high frequency current turning directions of a first spiral inductor 101 and a second spiral inductor 105 are the same, a third circular or rectangular spiral inductor is formed on the top surface of the sub-substrate opposite to the bump-formed surface, a third circular or rectangular spiral inductor is formed on the top surface of the sub-substrate, and a fourth spiral inductor is formed on the bottom surface of the sub-substrate.
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