Optical semiconductor device to optical substrate attachment method.

摘要

A method of attaching a semiconductor die (10) to a substrate (26) includes forming a metallic bump (17) on the semiconductor die (10) to extend a distance (20) from the semiconductor die (10). A conductive epoxy bump (18) is then formed on the metallic bump (17). The conductive epoxy bump (18) is placed in contact with the substrate (26). The conductive epoxy bump (18) is rapidly cured to maintain precise alignment between the semiconductor die (10) and the substrate (26).