发明名称 |
Solid state image sensor. |
摘要 |
<p>This solid state image sensor includes: a number of photodiodes arranged in a plane two dimensional array in several X axis direction photodiode rows; an X axis CCD for each photodiode row, each including a number of CCD elements of which at least one corresponds to each one of the photodiodes in the corresponding photodiode row, each of the X axis CCDs transmitting in the X axis direction photoelectric conversion signals output from its corresponding photodiode row; a Y axis CCD which transmits in the Y axis direction photoelectric conversion signals which it receives from the X axis CCDs; and at least one relay CCD element for each X axis CCD, each connecting between its corresponding X axis CCD and the Y axis CCD and outputting to the Y axis CCD photoelectric conversion signals which it receives from its corresponding X axis CCD. And, the length of at least the relay CCD element which is next to the Y axis CCD is longer than the length of one of the X axis CCD elements. Optionally but desirably, the boundary between a region which receives light from an object to be photographed and which includes a number of the photodiodes, and a region over which light from the object is intercepted and which includes the Y axis CCD, lies over the relay CCD elements. <IMAGE></p> |
申请公布号 |
EP0633613(A1) |
申请公布日期 |
1995.01.11 |
申请号 |
EP19940201939 |
申请日期 |
1994.07.05 |
申请人 |
NIKON CORPORATION;SONY CORPORATION |
发明人 |
TAKAGI, TADAO;GOTO, TETSURO;IWASAKI, HIROYUKI;MAKI, YASUHITO, C/O SONY CORPORATION |
分类号 |
G01J1/02;G01J1/44;H01L27/148;H04N5/335;H04N5/353;H04N5/359;H04N5/361;H04N5/369;H04N5/3728;H04N5/378;(IPC1-7):H01L31/021 |
主分类号 |
G01J1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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