发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PURPOSE:To apply adhesive uniformly to the application surface of a substrate by moving a nozzle in parallel while maintaining it at a specific height, discharging the adhesive when one edge part of an application region is reached. and then stopping the discharge when a specific position of the other edge part is reached. CONSTITUTION:A nozzle 13 is moved from one edge part of an application region 12 (one edge part is a reference X(Y)=0 and the other edge part is X(Y)=a) of the application surface of a substrate 11 such as a lead frame onto a position away by a certain distance toward the outside. Then, the nozzle 13 is lowered from an application surface (a surface where an application region belongs to) to the position of a specific height h2 (X(Y)=-b, Z=h2) and is moved in parallel toward the other edge part of the application region 12. Then, when the nozzle 13 reaches one edge part of the application region 12, an adhesive starts to be discharged from the discharge port at the tip of the nozzle 13. Then, when the nozzle 13 reaches a specific position (X(Y)=C, provided 0<c<a) before the other edge part of the application region 12, the discharge of the adhesive is stopped.
申请公布号 JPH077030(A) 申请公布日期 1995.01.10
申请号 JP19930147990 申请日期 1993.06.18
申请人 TOSHIBA CORP 发明人 KUROSAWA TETSUYA;OSHIMA MASAYUKI
分类号 B05C5/00;H01L21/52;(IPC1-7):H01L21/52 主分类号 B05C5/00
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