| 摘要 |
PURPOSE:To provide a multilayer printed interconnection board in which electric connection properties of conductor patterns of layers can be tested without providing a mini-through hole and an inspecting land. CONSTITUTION:In order to execute a continuity check between circuits of layers before placing electronic components or input/output functional test between the circuits of the layers after placing the components, copper foils 4 of predetermined parts of one side or both side surfaces are removed by etching, an insulating layer 2 exposed at the part is removed by dissolving it in alkaline water solution to expose lands 6, 8, 9 of an inner layer circuit, and check lands 16, 17, 18 for checking electrical connection between the circuits of the layers or testing functions are formed at the lands 6, 8, 9, respectively. Incidentally, a multilayer printed interconnection board is formed by laminating copper-plated insulating sheets in which the layers 2 made of insulating resin soluble in the water solution are formed on the foil surfaces 4. |
