| 摘要 |
<p>PURPOSE: To provide an integrated circuit module, with which the contact pads of plural chips with various levels of thickness can be positioned on a plane, without thinning chips. CONSTITUTION: A substrate material 12 is molded directly to semiconductor chips 14 and other electrical components 20 which are positioned for producing an integrated circuit module. The chips 14 having contact pads 15 are placed on an adhesive agent layer 12a, which is supported by a base part 10, while turning their surfaces downwards. A mold form is positioned around the chips 14. A substrate molding material is added within the mold form and hardened later. A dielectric layer, having vias alighed with the predetermined contact pad 15 and having an electrical conductor extending through this vias, is situated on the surface of hardened substrate molding material and chips. Before adding the substrate molding material, a heat plug can be fixed on the backside of the chip.</p> |
