| 摘要 |
Disclosed is a single component heat activated structural adhesive system. This system cures at 250.degree.F - 300.degree.F in 30 - 60 seconds and achieves 70-90% of final cure, providing sufficient bond strength for handling sheet molding compounds (SMC) or bulk molding compounds (BMC). This system also provides dimensional stability without sagging, running, and read- through. The green strength obtained from the curing cycle provides about 20 - 100% Fiber Tear, enough to complete the paint bake step, which the bonded parts are subjected to 300.degree.F - 350.degree.F for 20 - 30 minutes. Following the bake cycle, the cure is complete.
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