发明名称 |
Semiconductor device with improved interconnections between the chip and the terminals, and process for its manufacture |
摘要 |
A chip of semiconductor material is fixed to a supporting area of a film of insulating material. Electrical interconnecting elements join metallized areas of the chip to the ends of metal strips which form the terminals of the device. To obtain devices with numerous terminals without approaching the dimensional limits imposed by the manufacture of the terminal frames, the interconnecting elements include electrically conductive tracks formed on the film of insulating material. The electrical connection between the ends of the terminals and the tracks is made by strips of anisotropic conductive material.
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申请公布号 |
US6396132(B1) |
申请公布日期 |
2002.05.28 |
申请号 |
US20000502070 |
申请日期 |
2000.02.10 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
BOZZINI PIERAMEDEO |
分类号 |
H01L21/56;H01L21/60;H01L23/02;H01L23/495;H01L23/498;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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