Verfahren zum Herstellen eines Metall-Keramik-Substrates

摘要

The invention relates to a new process for manufacturing a ceramic-metal substrate which consists of at least one ceramic layer (2) and of at least two metal layers (3, 4) which are in each case provided on top of the ceramic layer (2), and which substrate has at least one electrical through-conductive region (5) on which the metal layers (3, 4) are electrically connected to one another in the region of an opening or a window (6) in the at least one ceramic layer (2) by means of a metal link (7), in the case of which (process) metal foils or platelets (3', 4') (whose surfaces are formed by chemical bonding of the metal with a reactive gas) are mounted by means of the direct bonding process on the top of the at least one ceramic layer (2) in order to form the metal layers (3, 4), and in the case of which (process) a metal which forms the link (7) is introduced into the at least one opening or into the at least one window (6) in order to manufacture the through-plated region (5), via which metal the metal layers (3, 4) are electrically connected to one another by means of the direct bonding process.