Method of packaging electronic circuit components and packaged circuit arrangement.

摘要

An encapsulated electronic part (1) has a resin body (2) and a projecting holding member (3) removably attached to the resin body (2) which may be made of the same resin and formed at the same time as the resin body (2). The encapsulated electronic part (1) may be conveyed to a test device (6) or to a circuit board and mounted thereon by gripping the holding member (3) with a holding device (5). The holding member (3) may have a shape conforming to the shape of the holding device (5) and may be separated from the resin body (2) by moving the holding device (5) while holding the resin body (2) stationary.