| 摘要 |
PURPOSE: To provide light mutual connection structure having improved productivity and high reliability and capable of attaining high density mutual connection. CONSTITUTION: The light mutual connection structure attains data transfer in a single integrated circuit and mutual connection between plural integrated circuits. Photoelectronic transmitters 19, 21 and receivers produced under an optimum condition are connected to planar optical waveguides 110, 12. The waveguides 11, 12 include hologram elements 14, 16, 16', 17, 18 for orientating light emitted from the transmitters 19, 21 to the waveguides 11, 12. Other hologram elements built in the waveguides 11, 12 diffract the emitted light and output the diffracted light to photoelectronic receivers 22, 22', 23. The whole structure is produced and tested independently of the integrated circuits to be mutually connected. Then the mutually connected structure is connected to the integrated circuits by control collapse chip connection or soldering bump technology. |
