| 摘要 |
<p>PURPOSE:To provide a method for manufacturing a resin-sealed semiconductor element using a lead frame in which a surface mount semiconductor element can be manufactured with high productivity of a product with high reliability. CONSTITUTION:A semiconductor chip 2 is mounted on a chip amount 2a of a lead frame 1 in which outer leads 1b are previously bent as prescribed, the chip is bonded to the leads via wires 3, a periphery of the chip is then sealed with resin 4 in the frame, a tie bar 1c is further cut to divid into individual elements. Thus, a defect of a resin package due to a stress caused by bending the lead can be avoided.</p> |
