| 摘要 |
<p>PURPOSE:To provide an electronic circuit package for mounting an electronic component formed by bending or drawing a metal base board in which torsion is suppressed and imperfect joint with another circuit board is prevented. CONSTITUTION:After a circuit is formed by forming insulation layers 102, 104 and wiring conductors 103, 105 on a metal board 101, the metal board 101 is subjected to bending or drawing in order to form a flange 107 on the periphery of an open face 180. A frame body 109 composed of an organic resin composition is then provided inside at the bent part of the flange 107 along the outer peripheral face of the metal board 101 for an electronic circuit package 100.</p> |
