| 摘要 |
PURPOSE:To simplify the position alignment of both semiconductor elements and corresponding inner leads and outer leads by mounting the semiconductor element on bed parts, bending and overlapping the continued first and second lead frame parts at linking parts, and arranging both semiconductor elements at the facing positions. CONSTITUTION:Semiconductor element 9 are mounted on a respective bed parts 8 and 8. Lead frame 4 and 4 are bent and overlapped. The semiconductor elements 9 and 9 are arranged so as to face each other. The electrodes of the elements are connected to inner leads 2 and 2 through bonding wires 12, respectively. The connected inner leads 2 and 2 are connected to outer leads 3, which are guided out from molding resin in a zigzag. Thus, the positions of a plurality of the semiconductor element 9 and 9, the inner leads 2 and 2 and the outer leads 3 can be accurately determined. |
