PRODUCTION OF METALLIC PATTERNS

摘要

A method of making a metallic pattern on a substrate surface, the substrate surface comprising bare metal in predetermined areas and metal coated by a first resist in remaining areas which method comprises: (i) protecting the bare metal by electrodepositing a resinous film thereon; (ii) removing the first resist from said remaining areas using a solvent which does not remove the electrodeposited film; (iii) etching the metal exposed in (ii) using an etchant which does not remove the electrodeposited film; (iv) forming a layer of a second resist in a predetermined pattern over the electrodeposited film, thereby leaving areas of the electrodeposited film uncovered by the resist; and (v) removing the uncovered areas of the electrodeposited film by treatment with a solvent therefor. The method is useful in the production of printed circuit boards.