| 摘要 |
<p>A method of manufacturing surface acoustic wave devices includes providing a dielectric substrate (11') with a plurality of channels (12') which open onto a substrate surface region and each of which accommodates a metallic electrode (14), the electrodes being recessed below the substrate surface region by an actual distance which at least equals a desired distance at which the electrodes have a minimum acoustic reflectivity, testing the performance of the device to ascertain at least the acoustic reflectivity of the electrodes, and etching at least the dielectric substrate, when it is ascertained during the testing that the acoustic electrode reflectivity is excessive, at least at the substrate surface region to a predetermined etching depth. The use of this method results in a device having reduced post-etching acoustic electrode reflectivity as a result of the thus obtained reduction in the difference between the actual and desired distances.</p> |
