| 摘要 |
<p>PURPOSE:To accurately control sealing glass in thickness so as to keep a semiconductor device stably high in high frequency transmission characteristics by a method wherein a small hole is provided to the glass-sealed part of a package main body, a cap, or a seal frame. CONSTITUTION:Small holes 18 are bored in a part of a cap 12 in contact with a sealing glass 14 penetrating both its sides. The small holes 18 are disposed along the periphery of the cap 12 at a regular pitch. Through-holes 19 and 20 are provided to the cap 12 and a main body 11 respectively. The through- holes 19 and 20 are so formed as to enable their centers to be coincident with each other when the cap 12 is mounted on the main body 11. By this setup, sealing glasses 14 and 15 can be precisely controlled in thickness so as to obtain a package which covers a high frequency band.</p> |
