| 摘要 |
PURPOSE:To dispense with a cutting die which is used for scraping resin so as to lessen an investment cost. CONSTITUTION:A semiconductor device is sealed up with resin into a package, wherein cushioning materials 6a, 6b, 7a, and 7b are so disposed on the parts of an upper die 3 and a lower die 4 where a lead frame 6 is interposed as to traverse adjacent leads, whereby resin is prevented from flowing out of a cavity through a gap between the upper die 3 and the lower die 4. |
