发明名称 Heat-sealable connector sheet
摘要 Proposed is a novel heat-sealable connector sheet, by which very reliable electric connection can be obtained with electrode terminals on an electronic device or a circuit board, consisting of a flexible insulating plastic substrate sheet and a patterned electroconductive layer formed thereon from an electroconductive paste with an overcoating layer of an insulating melt-flowable adhesive. Different from the electroconductive pastes used in conventional connector sheets, the electroconductive paste used here is compounded with an appropriate amount of relatively coarse particles of an insulating material having elasticity, e.g., plastic resins. The patterned electroconductive layer is formed from such a composite conductive paste in such a fashion that the insulating particles are fully embedded in the conductive paste but forming protrusions on the surface of the patterned electroconductive layer which accordingly exhibits a rugged appearance.
申请公布号 US5371327(A) 申请公布日期 1994.12.06
申请号 US19930017638 申请日期 1993.02.12
申请人 SHIN-ETSU POLYMER CO., LTD. 发明人 FUJINAMI, NAOKI;YOSHIDA, KAZUYOSHI;ODASHIMA, SATOSHI
分类号 H01R4/04;H05K1/09;H05K3/30;H05K3/32;H05K3/36;(IPC1-7):H05K1/09 主分类号 H01R4/04
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