| 发明名称 |
Method of mounting a semiconductor device to a heat sink |
| 摘要 |
A method of mounting a semiconductor device to a heat sink where an opening in the circuit board is formed and sized to allow the semiconductor device to pass therethrough, where a heat sink is positioned on one side of the circuit board and a load is introduced on a second side of the circuit board and applied to the semiconductor device forcing it against the heat sink.
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| 申请公布号 |
US5369879(A) |
申请公布日期 |
1994.12.06 |
| 申请号 |
US19930049206 |
申请日期 |
1993.04.19 |
| 申请人 |
EATON CORPORATION |
发明人 |
GOESCHEL, FREDERICK G.;LANTING, MARK L.;MCCONNELL, ARDEN M. |
| 分类号 |
H01L23/36;H01L23/34;H01L23/40;H05K7/20;(IPC1-7):H05K13/04;B23P19/04 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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