COMPOSITE INTEGRATED CIRCUIT COMPONENT

摘要

PURPOSE:To achieve high-density mounting by reducing unnecessary processes by compounding a thin-film integrated circuit element and at least one of lamination type inductor or lamination type capacitor and by forming this lamination type capacitor or inductor in a thin film integrated circuit on a substrate. CONSTITUTION:A quartz substrate with a high heat resistance is used, for example, for a substrate 100, and a thin film integrated circuit 101 having a silicon gate type TFT using a silicon material is provided as electric wiring on the substrate 100. A fetch electrode 102 of this thin film integrated circuit is formed on the same substrate 100. A silicon oxide film 109 as a protective film covering this thin film integrated circuit 101 is formed, and a through hole is formed at the portion corresponding to the fetch electrode 102. A capacitor portion 103 and an inductor 104 are provided as a laminated construction on the protective film 109.