| 摘要 |
<p>PURPOSE:To obtain the resist ink composition capable of forming a solder resist film superior in electroless gold plating resistance and high in reliability by using a specified resin having acrylic groups and epoxy groups in the molecule. CONSTITUTION:This resist ink composition contains (A) an active light setting and thermosetting resin represented by the formula in which each of m and n is an integer and m/n is 3/7-15/85, (B) an active light setting resin obtained by reaction between the reaction product (of an epoxy compound with an unsaturated monobasic acid) and a saturated or unsaturated polybasic acid, (C) a photopolymerization initiator, and (D) an epoxy compound having >=2 epoxy groups in one molecule in a pts.wt. of A, C, and D of 5-20, 2-30, and 5-40 to 100 pts.wt. of B, respectively, thus permitting this composition to be enhanced in sensitivity to exposure light, easily photocured in a short exposure time, and easily developed with an aqueous solution of weak alkali, such as sodium carbonate.</p> |
