| 摘要 |
PURPOSE: To eliminate thermal mismatching from a semiconductor chip module by a method wherein a semiconductor chip and a semiconductor substrate are provided, and the semiconductor chip is bonded to the semiconductor substrate without using epoxy resin or a metal layer. CONSTITUTION: The backside 22 of a semiconductor chip 20 is joined to the front 31 of a semiconductor substrate 30. The semiconductor chip 20 is bonded to a part of the semiconductor substrate 30 without using adhesive medium (epoxy) or a metal layer. A very important thing is that adhesive medium or a metal layer is substantially different in thermal expansion coefficient from the semiconductor chip 20 or the semiconductor substrate 30 but has thermal properties which match with those of the semiconductor chip 20 and the semiconductor substrate 30. Therefore, serious thermal mismatching hardly occurs in a semiconductor chip module 35. By this setup, a lot of trouble mechanism related to an interconnection system with thermal mismatching can be avoided. |
