发明名称 MULTILAYERED SUBSTRATE
摘要 <p>PURPOSE:To lessen the effect on propagation between circuit blocks through the intermediary of a power supply layer by a method wherein the power supply paths to through holes per respective circuit blocks are to be formed of independent linear patterns per circuit block. CONSTITUTION:The power supply paths from the power supply part 22 on a power supply layer 7 to the through holes per respective blocks of a C layer 10 and a D layer 15 are formed of independent linear patterns 8 per circuit block. Next, in order to actuate various electronic elements on the C and D layers 10, 15, a power is to be supplied from the power supply layer 7 through the intermediary of the linear patterns 8 and said through holes. At this time, respective signals in the frequencies f1, f2, f3, f4 adopted in respective paths are inversely transmitted through the power supply layer 7. However, the propagation paths are to be lengthened through the intermediary of the linear patterns 8 and the power supply part 22 thereby enabling the effect on the propagation to be lessened. Furthermore, the effect between approximate linear patterns 8 can be lessened by a base plate pattern 21.</p>
申请公布号 JPH06334349(A) 申请公布日期 1994.12.02
申请号 JP19930122656 申请日期 1993.05.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 HASEGAWA SHINJI
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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