| 摘要 |
<p>PURPOSE:To provide a substrate structure and its manufacturing method that enables to prevent the contact of compressed bonding electrodes with neighboring bonding electrodes simply and easily, and the shift of positions between the first semiconductor substrate and the second semiconductor substrate. CONSTITUTION:With a substrate structure, of which substrates are bonded with the bonding electrodes, it consists of the first substrate 1, with which partition plates 5 that are insulators to prevent the short circuit between the neighboring bonding electrodes 4a are formed between bonding electrodes 4a, and the second substrate 6 with which grooves 6b to insert the partition plates 5 are formed between bonding electrodes 9a.</p> |
