| 摘要 |
PURPOSE:To easily connect a lead frame to a package and to reduce the dislocation of facing leads. CONSTITUTION:An IC chip 28 is mounted on a ceramic substrate 23, and electrodes for the IC chip 28 are connected to conductor patterns 25 on the substrate 23. Tie bars 21 made of a material whose coefficient of thermal expansion is nearly equal to that of the substrate 23 are thermocompression-bonded, in parts of fixing and bonding conductor films 21b, to connection parts 22b at metal leads 22. Connection parts 22a at the metal leads 22 are connected, by a brazing operation, to metal pads 24 which are connected to the conductor patterns 25. |
