发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION AND PATTERN FORMING METHOD
摘要 PURPOSE:To obtain a resolution of <=0.5mum with advantage by using the line (i) exposure method and a specified sulfonic ester containing no isomer as a photosensitive agent. CONSTITUTION:This positive type photoresist composition mainly comprises an alkali-soluble resin and the photosensitive agent of 1,2-naphthoquinone-2- diazido-5-sulfonic acid (partial) ester of 1,1,3-tris-(4-hydroxy-3,5-dimethylphenyl)- butane represented by the formula in which D is H or a 1,2-naphthoquinone-2- diazido-5-sulfonyl group. The resist pattern high in resolution and deep in focal depth can be obtained by coating a substrate with this composition and prebaking it, and then, exposing and developing it, and using the CEL process in combination.
申请公布号 JPH06332167(A) 申请公布日期 1994.12.02
申请号 JP19930144273 申请日期 1993.05.24
申请人 SHIN ETSU CHEM CO LTD 发明人 UMEMURA MITSUO;KANBARA HIROSHI;INUKAI TETSUYA;NISHIKAWA KAZUHIRO
分类号 G03F7/022;G03F7/095;G03F7/26;H01L21/027;H01L21/30;(IPC1-7):G03F7/022 主分类号 G03F7/022
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