发明名称 MULTILAYER INTERCONNECTION BOARD
摘要 PURPOSE:To prevent generation of cracks and breaking by reducing the concentration of stress on the boundary part between a flexible wiring board and a hard board. CONSTITUTION:In the title multilayer interconnection board formed by laminating a flexible wiring board and a hard board 12 through an adhesive material layer 13 in such a manner that a part of the flexible wiring board is exposed, the end part of the adhesive material layer 13 is protruded to the boundary part of the flexible wiring board and the hard board 12.
申请公布号 JPH06326424(A) 申请公布日期 1994.11.25
申请号 JP19930114616 申请日期 1993.05.17
申请人 SHARP CORP 发明人 OHATA TAKAFUMI;ANDO HIDEKI
分类号 H05K1/02;H05K3/00;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/02
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