发明名称 FORMATION METHOD FOR MINUTE PATTERN IN SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE: To make it possible to form a very fine pattern and loosen a stepped area as a whole by etching anisotropically the entire surface formed with a photoresist pattern as a result and etching a patterned layer as the photoresist pattern and an etched byproduct as an etching mask. CONSTITUTION: A photoresist is coated on the surface of a layer to be patterned formed on a substrate 21. The photoresist is patterned, thereby forming a photoresist pattern 25. Then, an anisotropic etching process is executed on the entire surface as a result of the formation of the photoresist pattern, thereby forming an etching byproduct 26 on the side wall of the photoresist pattern. Then, the photoresist pattern 25 and the etching byproduct 26 are used as the etching mask, thereby etching the layer 22 to be patterned. This construction makes it possible to form a fine pattern below the exposure limit of a stepper.</p>
申请公布号 JPH06326061(A) 申请公布日期 1994.11.25
申请号 JP19940077582 申请日期 1994.04.15
申请人 SAMSUNG ELECTRON CO LTD 发明人 RI KOUKEN;KOU SHIYOUZUI;KIN KIYOUSHIYOU;KIN SAIKOU;KAN BINSHIYAKU;KO MASAHITO
分类号 H01L21/302;H01L21/02;H01L21/033;H01L21/3065;H01L21/8242;(IPC1-7):H01L21/302 主分类号 H01L21/302
代理机构 代理人
主权项
地址