发明名称 RESIN PACKAGING METHOD FOR ELECTRONIC PART
摘要 PURPOSE:To coat an electronic part with exterior resin sufficiently, and prevent a deterioration in strength and airtightness of the resin, by making a reference line on a terminal of the electronic part as a maximum lower bound of coating with the resin, and coating a terminal from the reference line to an element side with a repellent material that repels a lubricant. CONSTITUTION:Each reference line 6 is provided on terminals 3, 4 and 5 as a maximum lower bound of exterior coating with resin 9. A repellent material 7, such as polyesteramide, against a lubricant 8 is applied to terminals 3, 4 and 5 partly from the reference line 6 near to an electronic-part element 2. Then, the repellent material 7 applied from the reference line 6 near to the electronic-part element 2 repels the lubricant 8 even when the lubricant is applied by mistake or runs over the reference line 6 near to the electronic-part element 2. In this way, the lubricant 8 is prevented from adhering over the reference line 6 near to the electronic-part element 2, and a deterioration in strength and airtightness of the exterior resin can be prevented.
申请公布号 JPH06325989(A) 申请公布日期 1994.11.25
申请号 JP19930109090 申请日期 1993.05.11
申请人 MURATA MFG CO LTD 发明人 MIURA SATOSHI
分类号 H01G4/228;H01C17/02;H01G13/00;H01L21/56;H03H3/02;H04R17/00;(IPC1-7):H01G13/00 主分类号 H01G4/228
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