METALLIC BASE PRINTED-WIRING BOARD AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE:To easily expose the metallic base surface of a metallic base printed- wiring board thereby enabling a semiconductor chip to be directly die-bonded onto the surface. CONSTITUTION:A copper plated insulating sheet whereon an insulating layer 2 comprising an insulating resin soluble in an alkalic water solution is formed is laminated on one or both surfaces of a metallic substrate 1 and then specific part of said sheet is selectively etched away to melt away the insulating layer 2 on that part so that the metallic substrate 1 surface may be exposed to die- bond a semiconductor chip 9 onto the exposed part for enhancing the radiating effect.